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Manufacturing & Capability

With our capability, we support full range of manufacturing service starting from simple to complex board assembly, subsystem assembly and full or final system assembly ready to ship to end user. Some of our capabilities

• 11 SMT lines in 2 factories
• Through whole auto insertion machines.
• FLIP CHIP Technology
• Chip-On-Board (COB)
• Flexible Printed Circuit Assembly (FPCA)
• In line solder past inspection
• In line Automatic Optical Inspection (AOI)
• X-Ray Inspection
• DI water cleaning
• In house laser engraving
• Conformal coating eg. Spray, Dip etc.
• Potting process eg. poly urethane or epoxy etc.
• In circuit and functional test
• Static walk-in burn in chamber
• Dynamic burn in chamber
• Complete Product Assembly : Box-Build to retail packing assembly
• Failure analysis equipment
• Various logistics from order fulfillment service to warehousing services eg. Direct shipment to end customers, Milk run delivery in overseas market, hub for the region etc. with on line monitoring.
• Kanban and certified Lean-Sigma and IPC team
• ROHS/REACH compliance